Cadence AuraStack AI: PCB & Package Design Revolution

7h ago·0:00 listen·Source: digitimes

Summary

Cadence has introduced a new agentic AI platform. It's called the AuraStack AI Super Agent on Allegro AI Studio. This platform is designed for printed circuit board and advanced packaging design. Cadence describes it as the world's first such platform. This development could streamline complex design processes in electronics.

Read the full article on digitimes →

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